Novel low melting point alloy-loaded polymer composite. II. Resistivity-temperature behavior

Journal of Applied Polymer Science

Volumn 77, Issue 4, 2000, Pages 756-763

  Zhang, Xiangwu ^a   Pan, Yi ^a   Shen, Lie ^a   Yi, Xiaosu ^b  

^a ZHEJIANG UNIVERSITY   (China)

^b Natl Key Lab of Adv Composites   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY OF SOLIDS; ENERGY DISPERSIVE SPECTROSCOPY; INTERFACIAL ENERGY; MORPHOLOGY; PARTICLE SIZE ANALYSIS; PHASE DIAGRAMS; POLYSTYRENES; POSITIVE TEMPERATURE COEFFICIENT; SCANNING ELECTRON MICROSCOPY; THERMAL EFFECTS; TIN ALLOYS; VISCOSITY;

LOW MELTING POINT ALLOY; TIN LEAD ALLOY;

NONMETALLIC MATRIX COMPOSITES;

EID: 0033699401     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1097-4628(20000725)77:4<756::AID-APP7>3.0.CO;2-Y     Document Type: Article

References (16)

1. Malliaris, A.; Turner, D. T. J Appl Phys 1971, 42, 614.
2. Matsushia, R.; Senna, M.; Kuno, H. J Mater Sci 1977, 12, 509.
3. Nicodemo, L.; Nicolais, L.; Romeo, G.; Scufora, E. Polym Eng Sci 1978, 18, 293.
4. Bhattacharya, S. K.; Basu, S.; De, S. K. Composites 1978, July, 177.
5. Lyons, A. M. Polym Eng Sci 1991, 31, 445.
6. Li, L.; Chung, D. D. L. Polym Compos 1993, 14, 361.
7. Toshiba Chemical Products, Jpn Patent 56 220 714, Dec. 1983.
8. Tanaka, H.; Hayashi, T.; Nishi, T. J Appl Phys 1989, 65, 4480.
9. Wang, B. X.; Yi, X. S.; Pan, Y.; Shan H. F. J Mater Sci. Lett 1997, 16, 2005.
10. Meyer, J. Polym Eng Sci 1973, 13, 462.
11. Ohe, K.; Nitio, Y. Jpn J Appl Phys 1971, 10, 99.
12. Narkis, M. Polym Eng Sci 1978, 18, 649.
13. Medalia, A. I. Rubb Chem Technol 1985, 59, 432.
14. Cui, G. W. In Surface and Interface; Gui, G. W., Ed., Tsinghua: Peking, 1990; p 57.
15. Lux, F. J Mater Sci 1993, 28, 285.
16. Miyasaka, K.; Watanabe, K.; Jojima, E. J Mater Sci 1982, 17, 1610.