Highly thermal-stable, plasma-polymerized BCB polymer film (k = 2.6) for Cu dual-damascene interconnects

Digest of Technical Papers - Symposium on VLSI Technology

Volumn , Issue , 2000, Pages 20-21

  Kawahara, J ^a   Shiba, K ^a   Tagami, M ^a   Tada, M ^a   Saito, S ^a   Onodera, T ^a   Kinoshita, K ^a   Hiroi, M ^a   Furuya, A ^a   Kikuta, K ^a   Hayashi, Y ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CMOS INTEGRATED CIRCUITS; ELECTRIC CONTACTS; OSCILLATORS (ELECTRONIC); PERMITTIVITY; PLASTIC FILMS; POLYMERIZATION;

DUAL-DAMASCENE INTERCONNECTS; PLASMA POLYMERIZATION;

VLSI CIRCUITS;

EID: 0033697430     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)