Tolerance and precision study for solder self-assembled MEMS

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4075, Issue , 2000, Pages 173-184

  Harsh, Kevin F ^a   Kladitis, Paul E ^a   Zhang, Yanhang ^a   Dunn, Martin L ^a   Bright, Victor M ^a   Lee, Y C ^a  

^a UNIVERSITY OF COLORADO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FITS AND TOLERANCES; HINGES; INTEGRATED CIRCUIT MANUFACTURE; SOLDERING; SUBSTRATES; SURFACE TENSION;

MICROELECTROMECHANICAL SYSTEMS; SELF ASSEMBLY;

MICROELECTROMECHANICAL DEVICES;

EID: 0033696221     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)