Microstructure and semiconducting properties of c-BN films using r.f. plasma CVD thermally assisted by a tungsten filament

Thin Solid Films

Volumn 368, Issue 2, 2000, Pages 283-286

  Wang, W L ^a   Liao, K J ^a   Wang, S X ^a   Sun, Y W ^a  

^a CHONGQING UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION SPECTROSCOPY; COMPRESSIVE STRESS; CRYSTAL MICROSTRUCTURE; DOPING (ADDITIVES); ELECTRIC CONDUCTIVITY; ELECTRON ENERGY LOSS SPECTROSCOPY; INTERFACIAL ENERGY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SEMICONDUCTING SILICON; STRUCTURE (COMPOSITION); TUNGSTEN;

INFRARED ABSORPTION SPECTRA;

CUBIC BORON NITRIDE;

EID: 0033689902     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(00)00783-5     Document Type: Article

References (15)

1. Wentorf R.H. J. Chem. Phys. 26:1957;956.
2. Liao K.J., Wang W.L. Phys. Status Solidi (a). 144:1994;K73.
3. Vel L., Demazeau O., Etourneau J. Mater. Sci. Eng. B. 10:1991;149.
4. Kleinman L., Phillips J.C. Phys. Rev. B. 117:1960;117.
5. Satou M., Fujimoto F. Jpn. J. Appl. Phys. 22:1983;L171.
6. Inagawa K., Watanabe K., Ohsano H., Saitoh K., Itoh A. Proc. 10th Symp. ISIAT. 86:1986;381.
7. Chayahara A., Yokohama H., Imura T., Osaka Y., Fujisawa M. ISPC-8, Tokyo. 1987;2440.
8. Liao K.J., Wang W.L. Chin. Phys. Lett. 12:(1):1995;58.
9. Mieno M., Yoshida T. Jpn. J. Appl. Phys. 29:1990;L1175.
10. Saitah H., Yarbrough W.A. Appl. Phys. Lett. 56:(22):1991;2482.
11. Kuhr M., Reinke S., Kulisch W. Surf. Coat. Technol. 74:1995;806.
12. Amorim J., Maciel H.S., Sudano J.P. J. Vac. Sci. Technol. B. 9:1991;362.
13. Miyamoto H., Hirose M., Osaka Y. Jpn. J. Appl. Phys. 22:1983;L216.
14. Masami J., et al. J. Appl. Phys. 20:1981;289.
15. McKenzie D.R., McFall W.D., Sainty W.G., Davies C.A., Collins R.E. Diam. Rel. Mater. 2:1993;970.