Effect of coupling agents on underfill material in flip chip packaging

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2000, Pages 183-188

  Luo, Shijian ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; AGING OF MATERIALS; BUTENES; CURING; ELECTRONICS PACKAGING; EPOXY RESINS; GLASS TRANSITION; INTEGRATED CIRCUIT MANUFACTURE; PASSIVATION; THERMAL EXPANSION; TITANIUM COMPOUNDS; ZIRCONIUM COMPOUNDS;

BENZOCYCLOBUTENE; COUPLING AGENTS; THERMAL EXPANSION COEFFICIENT; UNDERFILLS; ZIRCONATE;

FLIP CHIP DEVICES;

EID: 0033685194     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)