High-aspect-ratio electroformed Ni-Co microstructures with improved mold adhesion using a LIGA-like process and a Novolak sublayer

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4019, Issue , 2000, Pages 484-491

  Malek, Chantal Khan ^a   Thomas, Lowell ^a  

^a LOUISIANA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ELECTROFORMING; METALLOGRAPHIC MICROSTRUCTURE; MICROMACHINING; NICKEL ALLOYS; PLASTIC MOLDS; POLYMETHYL METHACRYLATES; SHEAR STRESS; SUBSTRATES; X RAY LITHOGRAPHY;

NICKEL COBALT ALLOYS;

MICROELECTROMECHANICAL DEVICES;

EID: 0033682912     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (26)