Dielectric relaxation and mechanical properties of liquid crystalline epoxy thermosets

Journal of Applied Polymer Science

Volumn 77, Issue 7, 2000, Pages 1568-1573

  Lu, M G ^a   Shim, M J ^a   Kim, S W ^a  

^a University of Seoul   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; DEFORMATION; DIELECTRIC RELAXATION; EPOXY RESINS; LIQUID CRYSTAL POLYMERS; MOLECULAR ORIENTATION; TENSILE STRENGTH; TENSILE TESTING;

THERMAL SIMULATED CURRENT;

THERMOSETS;

EID: 0033682751     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/1097-4628(20000815)77:7<1568::AID-APP18>3.0.CO;2-1     Document Type: Article

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