Step & stamp imprint lithography using a commercial flip chip bonder

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3997, Issue , 2000, Pages 874-880

  Haatainen, Tomi ^a   Ahopelto, Jouni ^a   Gruetzner, Gabi ^a   Fink, Marion ^a   Pfeiffer, Karl ^a  

^a VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

ETCHING; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; MASKS; NANOTECHNOLOGY; PLASTIC COATINGS; SEMICONDUCTOR DEVICE STRUCTURES; SILICON WAFERS; THERMOPLASTICS;

NANOIMPRINT LITHOGRAPHY;

PHOTORESISTS;

EID: 0033682561     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)