Flow network modeling for improving flow distribution of microelectronics burn-in oven

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2000, Pages 78-81

  Lian, Bin ^a   Dishongh, Terrance ^a   Pullen, David ^a   Yan, Hongfei ^a   Chen, Jing ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; FAILURE ANALYSIS; FLOW MEASUREMENT; HEAT RESISTANCE; HEAT SINKS; HEAT TRANSFER; HIGH TEMPERATURE TESTING; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; THERMAL STRESS;

BURN IN OVEN; FLOW DISTRIBUTION; FLOW NETWORK MODELING;

MICROELECTRONIC PROCESSING;

EID: 0033678577     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (5)