RF power amplifier integration in CMOS technology

IEEE MTT-S International Microwave Symposium Digest

Volumn 1, Issue , 2000, Pages 545-548

  Chen, Y J E ^a   Hamai, M ^a   Heo, D ^a   Sutono, A ^a   Yoo, S ^a   Laskar, J ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BLUETOOTH POWER AMPLIFIERS; CMOS RADIO FREQUENCY POWER AMPLIFIERS; LOW TEMPERATURE COFIRED CERAMICS;

CAPACITORS; CERAMIC MATERIALS; CMOS INTEGRATED CIRCUITS; ELECTRIC INDUCTORS; MICROPROCESSOR CHIPS; WIRELESS TELECOMMUNICATION SYSTEMS;

POWER AMPLIFIERS;

EID: 0033678284     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (5)

1. D. Su and W. McFarland, "A 2.5-V, 1-W Monolithic CMOS RF Power Amplifier," Proc. IEEE Custom Integrated Circuit Conference, pp. 189-192,1997.
2. K. Tsai and P. Gray, "A 1.9-GHZ, 1-W CMOS Class-E Power Amplifier for Wireless Communications," IEEE Journal of Solid-State Circuits, vol. 34, No. 7, pp. 962-970, July 1999.
3. Y. E. Cha, D. Heo, J. Laskar, and T. Anderson, "Investigation of Q Enhancement for Inductors Processed in BiCMOS Technology," Proc. IEEE Radio and Wireless Conference, pp. 263-266, August 1999.
4. A. Sutono, A. Pham, I. Laskar, and W. R Smith, "Development of Three Dimensional Ceramic-Based MCM Inductors for Hybrid RF/Microwave Application," 1999 IEEE Radio Frequency Integrated Circuits Symposium, pp. 175-178.
5. W. Wersing, S. Gohlke, R. Matz, W. Eurskens, and V. Wannenmacher, "Integrated Passive Components Using Low Temperature Cofired Ceramics," Proceedings of the SPIE - The International Society for Optical Engineering, vol. 3582, pp. 193-199,1999.