Thermal-mechanical models for non-conforming surface contacts

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2000, Pages 290-295

  Yovanovich, M M ^a  

^a UNIVERSITY OF WATERLOO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT SINKS; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; POISSON RATIO; TEMPERATURE; THERMOMECHANICAL TREATMENT;

NONCONFORMING SURFACE CONTACTS; SILICON CHIP; THERMAL MECHANICAL MODELS;

INTERFACES (MATERIALS);

EID: 0033678277     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)