Low cost, high thermal conductivity composites for power electronics

International SAMPE Symposium and Exhibition (Proceedings)

Volumn 45, Issue , 2000, Pages

  Kowbel, W ^a   Patel, K ^a   Champion, W ^a   Withers, J C ^a   Choi, S ^a  

^a MER CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON CARBON COMPOSITES; COPPER; COST EFFECTIVENESS; METAL CLADDING; MICROPROCESSOR CHIPS; POWER ELECTRONICS; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTING SILICON; SILICON CARBIDE; THERMAL CONDUCTIVITY; THERMAL EXPANSION; TUNGSTEN;

CHIP-ON-BOARD (COB); ELECTRONIC PACKAGING; EPOXY BONDS; HEAT SPREADERS;

METALLIC MATRIX COMPOSITES;

EID: 0033676513     PISSN: 08910138     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (3)