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Volumn 4066, Issue , 2000, Pages 218-225
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Applications of MICP source for next generation photomask process
a a a a a
a
PKL
(South Korea)
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Author keywords
[No Author keywords available]
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Indexed keywords
CHROMIUM;
DEFECTS;
DRY ETCHING;
ELECTRODES;
ELECTRON CYCLOTRON RESONANCE;
MASKS;
PHOTORESISTS;
PLASMA DENSITY;
REACTIVE ION ETCHING;
SCANNING ELECTRON MICROSCOPY;
SUBSTRATES;
CRITICAL DIMENSION UNIFORMITY;
FACE DOWN LOADING;
MULTIPLE INDUCTIVELY COUPLED PLASMA;
PHOTOMASK PROCESS;
INTEGRATED CIRCUIT LAYOUT;
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EID: 0033674794
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1117/12.392028 Document Type: Conference Paper |
Times cited : (6)
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References (4)
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