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Volumn 21, Issue 4, 2000, Pages 347-362
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Thermostructural behavior of SiC fiber fabrics and implications for CMC
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Author keywords
[No Author keywords available]
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Indexed keywords
CERAMIC MATRIX COMPOSITES;
COMPUTER SIMULATION;
CREEP;
CREEP TESTING;
CRYSTAL MICROSTRUCTURE;
FABRICS;
HIGH TEMPERATURE PROPERTIES;
STOICHIOMETRY;
TENSILE STRENGTH;
TENSILE TESTING;
THERMAL EFFECTS;
WEAVING;
CREEP RUPTURE PROPERTIES;
HIGH TEMPERATURE CREEP PROPERTIES;
HIGH TEMPERATURE FAST FRACTURE PROPERTIES;
HIGH TEMPERATURE RUPTURE PROPERTIES;
THERMOSTRUCTURAL BEHAVIOR;
SILICON CARBIDE;
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EID: 0033671899
PISSN: 01966219
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (4)
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References (14)
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