New bonded composite wavy lap joint

Collection of Technical Papers - AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference

Volumn 1, Issue II, 2000, Pages 995-1003

  Zeng, Q ^a   Sun, C T ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); BONDING; DYNAMIC LOADS; INTERFACES (MATERIALS); NUMERICAL METHODS; SHEAR STRESS; STRENGTH OF MATERIALS; STRESS ANALYSIS; STRUCTURAL DESIGN; TENSILE STRESS;

BOND STRENGTH; COMPOSITE WAVY LAP JOINTS; INTERFACE PEEL STRENGTH; SINGULAR TENSILE PEEL STRESS; STRUCTURAL EFFICIENCY;

JOINTS (STRUCTURAL COMPONENTS);

EID: 0033671214     PISSN: 02734508     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)