Simulation of microcrack propagation behavior in polycrystalline alumina having initial residual stress field

Ceramic Engineering and Science Proceedings

Volumn 21, Issue 3, 2000, Pages 213-218

  Takigawa, Y ^a   Sakaida, Y ^a   Yasutomi, Y ^a   Ogawa, S ^a  

^a JAPAN FINE CERAMICS CENTER   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CRACK PROPAGATION; CRYSTAL ORIENTATION; CRYSTALLOGRAPHY; ELASTICITY; ELECTRON DIFFRACTION; FINITE ELEMENT METHOD; FRACTURE MECHANICS; GRAIN BOUNDARIES; MICROCRACKS; POLYCRYSTALLINE MATERIALS; RESIDUAL STRESSES;

ELECTRON BACK SCATTERED DIFFRACTION; MICROCRACK PROPAGATION; POLYCRYSTALLINE ALUMINA;

ALUMINA;

EID: 0033671012     PISSN: 01966219     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)