New kinetic model for degree of cure and viscosity in liquid molding application

International SAMPE Symposium and Exhibition (Proceedings)

Volumn 45, Issue , 2000, Pages

  Um, Moon Kwang ^a   Daniel, Isaac M ^a  

^a Korea Institute of Machine and Materials   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; EPOXY RESINS; MECHANICAL PERMEABILITY; PLASTICS MOLDING; REACTION KINETICS; VISCOSITY OF LIQUIDS;

LIQUID MOLDING;

THERMOSETS;

EID: 0033666490     PISSN: 08910138     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (21)