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Volumn 12, Issue 3, 2000, Pages 13-18
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Study of solder paste printing requirements for CSP technology
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRONICS PACKAGING;
PRINTING;
SOLDERING ALLOYS;
CHIPSCALE PACKAGING;
SOLDER PASTES;
STENCIL FABRICATION METHODS;
SURFACE MOUNT TECHNOLOGY;
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EID: 0033661401
PISSN: 09540911
EISSN: None
Source Type: Journal
DOI: 10.1108/09540910010347818 Document Type: Article |
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Times cited : (6)
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References (0)
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