Residual stresses in MEMS structures

Materials Research Society Symposium - Proceedings

Volumn 594, Issue , 2000, Pages 231-236

  Majumdar, D S ^a   Cowan, W D ^b   Pagano, N J ^b  

^a NEW MEXICO INSTITUTE OF MINING AND TECHNOLOGY   (United States)

^b AIR FORCE RESEARCH LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GOLD; RESIDUAL STRESSES; SILICON; STRESS ANALYSIS; THERMAL EFFECTS; THERMAL EXPANSION;

THERMAL EXPANSION COEFFICIENT;

MICROELECTROMECHANICAL DEVICES;

EID: 0033658904     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (6)

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2. J.A. Thornton and D.W. Hoffman, Thin Solid Films, Vol.171, pp.5-31 (1989)
3. W.D. Cowan, V.M. Bright, A.A. Alvin, and D.A. Koester, SPIE Microlithography and Metrology in Micromachining III, Vol.3525, pp.56-67 (1998)
4. S. Timoshenko, J. Opt. Soc. Am., Vol. 11, pp.233-255 (1925)
5. P.M. d'Huerle and J.M.E. Harper, Thin Solid Films, Vol. 171, pp.81-92 (1989)
6. G.G. Stoney, Proc. Roy Soc., Vol.9, pp.172-175 (1909)