Influence of the redeposition effect for focused ion beam 3D micromachining in silicon

International Journal of Advanced Manufacturing Technology

Volumn 16, Issue 12, 2000, Pages 877-880

  Fu, Y Q ^a   Bryan, N K A ^a   Shing, O N ^a   Hung, N P ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; ETCHING; FOCUSING; ION BEAMS; MICROMACHINING; MILLING (MACHINING); NANOTECHNOLOGY; SILICON WAFERS;

ION SPUTTERING; REDEPOSITION EFFECTS;

COMPUTER INTEGRATED MANUFACTURING;

EID: 0033658145     PISSN: 02683768     EISSN: None     Source Type: Journal    
DOI: 10.1007/s001700070005     Document Type: Article

References (7)

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