Stress development in low dielectric constant silica films during drying and heating process

Materials Research Society Symposium - Proceedings

Volumn 594, Issue , 2000, Pages 463-468

  Lu, Mengcheng ^a   Brinker, C Jeffrey ^b  

^a ADVANCED MATERIALS LABORATORY   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AEROGELS; DRYING; ELLIPSOMETRY; HEATING; PERMITTIVITY; RESIDUAL STRESSES; SILICA; SOL-GELS; STRESS ANALYSIS; SURFACE ACTIVE AGENTS; SURFACE TENSION; TENSILE STRESS;

CANTILEVER BEAM TECHNIQUE; LASER DEFLECTION METHOD; PRESSURE AEROGEL PROCESSES;

DIELECTRIC FILMS;

EID: 0033652705     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (11)

1. Kenneth R. Carter, Ultra Low k Workshop, ACS Division of Polymer Chemistry, Monterey, CA, Nov 14, (1999).
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3. Y. Lu, R. Ganguli, C. Drewien, M. Anderson, C. Brinker, W. Gong, Y. Guo, H. Soyez, B.Dunn, M. Huang, J. Zink, Nature, 389, 364(1997).
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5. C. J. Brinker, unpublished results.
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8. Mengcheng Lu, unpublished results.
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10. C.S. Sriram, Master Thesis, University of New Mexico, 1998.
11. C.J. Brinker, G.W. Scherer, Sol-Gel Science, The Physics and Chemistry of Sol-Gel Processing, (Academic Press Inc., 1990).