SCOPUS 정보 검색 플랫폼

Volumn 43, Issue 3, 2000, Pages 200-202

Lightweight electronic packaging technology based on spray formed Si-Al

a NONE

Author keywords

[No Author keywords available]

Indexed keywords

AVIONICS; ELECTRONICS PACKAGING; ELECTROPLATING; FITS AND TOLERANCES; THERMAL CONDUCTIVITY OF SOLIDS;

SPRAY FORMED SILICON ALLOYS;

SILICON ALLOYS;

EID: 0033651674 PISSN: 00325899 EISSN: None Source Type: Journal
DOI: None Document Type: Article

Times cited : (44)

References (15)

1
- 0025556903
- D. WHITE, S. KECK, I. SMITH, and A. SILZARS: Hybrid Circuit Technol., 1990, 12, (1), 14-19.
- (1990) Hybrid Circuit Technol. , vol.12 , Issue.1 , pp. 14-19
- White, D.¹ Keck, S.² Smith, I.³ Silzars, A.⁴

2
- 13144268639
- D. M. JACOBSON and S. P. S. SANGHA: Microelectron. Int., 1998, 15, (3), 17-21.
- (1998) Microelectron. Int. , vol.15 , Issue.3 , pp. 17-21
- Jacobson, D.M.¹ Sangha, S.P.S.²

3
- 0032099439
- C. ZWEBEN: JOM, 1998, 50, (6), 47-51.
- (1998) JOM , vol.50 , Issue.6 , pp. 47-51
- Zweben, C.¹

4
- 0342479688
- Materials Park, OH, ASM International
- K. A. SCHMIDT, B. T. RODINI, and C. ZWEBEN: in 'Electronic materials handbook', Vol. 1, 'Packaging', 1122-1125; 1989, Materials Park, OH, ASM International.
- (1989) 'Electronic Materials Handbook', Vol. 1, 'Packaging' , vol.1 , pp. 1122-1125
- Schmidt, K.A.¹ Rodini, B.T.² Zweben, C.³

5
- 0009738033
- Materials Park, OH, ASM International
- K. A. SCHMIDT and C. ZWEBEN: in 'Electronic materials handbook', Vol. 1, 'Packaging', 1126-1128; 1989, Materials Park, OH, ASM International.
- (1989) 'Electronic Materials Handbook', Vol. 1, 'Packaging' , vol.1 , pp. 1126-1128
- Schmidt, K.A.¹ Zweben, C.²

6
- 0001843775
- San Diego, CA, USA, September IEPS
- B. E. NOVICK and R. W. ADAMS: Proc. Int. Electronics Packaging Conf., San Diego, CA, USA, September 1995, IEPS, 220-227.
- (1995) Proc. Int. Electronics Packaging Conf. , pp. 220-227
- Novick, B.E.¹ Adams, R.W.²

7
- 0028722985
- R. F. JEFFRIES and D. J. BURROWS: GEC J. Res., 1994, 11, (3), 150-166.
- (1994) GEC J. Res. , vol.11 , Issue.3 , pp. 150-166
- Jeffries, R.F.¹ Burrows, D.J.²

8
- 0029752625
- A. R. CHAMBERS: Composites A, 1996, 27A, (2), 143-147.
- (1996) Composites A , vol.27 A , Issue.2 , pp. 143-147
- Chambers, A.R.¹

9
- 0028201653
- D. J. LLOYD: Int. Mater. Rev., 1994, 39, (1), 1-23.
- (1994) Int. Mater. Rev. , vol.39 , Issue.1 , pp. 1-23
- Lloyd, D.J.¹

10
- 0031249972
- S. P. S. SANGHA, D. M. JACOBSON, A. J. W. OGILVY, M. AZEMA, A. ARUN JUNAI, and E. BOTTER: Eng. Sci. Educ. J., 1997, 6, 195-201.
- (1997) Eng. Sci. Educ. J. , vol.6 , pp. 195-201
- Sangha, S.P.S.¹ Jacobson, D.M.² Ogilvy, A.J.W.³ Azema, M.⁴ Arun Junai, A.⁵ Botter, E.⁶

11
- 0032156705
- D. M. JACOBSON and S. P. S. SANGHA: CPMT (A), 1998, 21, (3), 515-520.
- (1998) CPMT (A) , vol.21 , Issue.3 , pp. 515-520
- Jacobson, D.M.¹ Sangha, S.P.S.²

12
- 0009072831
- A. LEATHAM, A. OGILVY, P. CHESNEY, and J. V. WOOD: Met. Mater., 1989, 3, (3), 140-143.
- (1989) Met. Mater. , vol.3 , Issue.3 , pp. 140-143
- Leatham, A.¹ Ogilvy, A.² Chesney, P.³ Wood, J.V.⁴

13
- 0342479686
- Aug.
- A. LEATHAM: Adv. Mater. Process., Aug. 1996, 31-34.
- (1996) Adv. Mater. Process. , pp. 31-34
- Leatham, A.¹

14
- 0030698616
- San Jose, CA, USA, May IEEE
- C. DREVON, S. GEORGE, A. COELLOVERA, M. POUYSEGUR, and J. L. CAZAUX: Proc. 47th Electronic Component and Technology Conf., San Jose, CA, USA, May 1997, IEEE, 497-501.
- (1997) Proc. 47th Electronic Component and Technology Conf. , pp. 497-501
- Drevon, C.¹ George, S.² Coellovera, A.³ Pouysegur, M.⁴ Cazaux, J.L.⁵

15
- 0030169053
- D. M. JACOBSON and S. P. S. SANGHA: Soldering Surf. Mount Technol., 1996, 23, (1), 12-15.
- (1996) Soldering Surf. Mount Technol. , vol.23 , Issue.1 , pp. 12-15
- Jacobson, D.M.¹ Sangha, S.P.S.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.