Evaluation of splat profile for droplet impingement

Surface and Coatings Technology

Volumn 115, Issue 2-3, 1999, Pages 184-192

  Amada, S ^a   Ohyagi, T ^a   Haruyama, M ^b  

^a GUNMA UNIVERSITY   (Japan)

^b OKI ELECTRIC INDUSTRY CO   (Japan)

Author keywords

Droplet; Flattening; Free fall; Molten metal; Peripheral profile; Unevenness ratio

Indexed keywords

CERAMIC MATERIALS; COPPER; ESCHERICHIA COLI; LEAD; LIQUID METALS; MOLTEN MATERIALS; PLASMA SPRAYING; REYNOLDS NUMBER; SOLIDIFICATION; SURFACE TENSION; TIN; VISCOSITY OF LIQUIDS;

RAYLEIGH INSTABILITY; UNEVENNESS RATIO;

SPRAYED COATINGS;

DROPLET; IMPINGEMENT; MELTING; METAL;

EID: 0033581051     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(99)00175-9     Document Type: Article

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