Polyimide coating on non-planar microelectronic devices: Characterization of vacuum drying effects by a new 'flip-paste' back-etching method

Surface and Coatings Technology

Volumn 122, Issue 2-3, 1999, Pages 214-218

  Sidorov, V ^a   Shai, A ^a   Ritter, D ^a   Paz, Y ^a  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

Coating; Flip paste; Heterojunction bipolar transistor; Non planar technology; Polyimide; Undercut

Indexed keywords

COATING; DRYING; INSULATION; POLYAMIDE;

EID: 0033573535     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(99)00173-5     Document Type: Article

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