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Volumn 32, Issue 3, 1999, Pages 305-316

Assessment of the effect of externally applied mechanical stress and water absorption on the electrical tree growth behaviour in glassy epoxy resins

Author keywords

[No Author keywords available]

Indexed keywords

BIREFRINGENCE; COMPRESSIVE STRESS; ELASTIC MODULI; ELECTRIC BREAKDOWN OF SOLIDS; ELECTRIC INSULATION; ELECTROCHEMICAL ELECTRODES; MICROSCOPIC EXAMINATION; RELAXATION PROCESSES; RESIDUAL STRESSES; STRUCTURE (COMPOSITION); TENSILE STRESS; WATER ABSORPTION; ABSORPTION; ELECTRODES; FAILURE (MECHANICAL); POLYMERS; STRESSES;

EID: 0033531294     PISSN: 00223727     EISSN: None     Source Type: Journal    
DOI: 10.1088/0022-3727/32/3/019     Document Type: Article
Times cited : (12)

References (17)
  • 3
    • 0025471720 scopus 로고
    • Hadid A, Laurent C, Mammeri R, Clavreul R, Duchateau F and Berdala J 1994 J. Physique III 4 35-53 Dissado L A and Hill R M 1990 IEEE Trans. Electr. Insul. 25 660-6
    • (1990) IEEE Trans. Electr. Insul. , vol.25 , pp. 660-666
    • Dissado, L.A.1    Hill, R.M.2
  • 12
    • 26744443966 scopus 로고
    • Dissado L A and Sweeney P J 1993 Phys. Rev. B 48 16 261-8 Fothergill J C, Dissado L A and Sweeney P J 1994 IEEE Trans. Dielectr. Electr. Insul. 1 474
    • (1993) Phys. Rev. B , vol.4 , pp. 816261-816268
    • Dissado, L.A.1    Sweeney, P.J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.