Guar concentration measurement with the CollaMat system

4th International Conference COPPER 99-COBRE 99

Volumn , Issue , 1999, Pages 643-651

  Stantke, P ^a  

^a Norddeutsche Affinerie AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; CATHODES; COMPOSITION; DECOMPOSITION; DEPOSITION; ELECTROLYSIS; ELECTROLYTES; GLUES; HYDROLYSIS; METAL REFINING; THERMAL EFFECTS;

CATHODE QUALITY; COPPER ELECTROLYTE; COPPER ELECTROREFINING; DECOMPOSITION RATE; GUAR ACTIVITY; GUAR CONCENTRATION MEASUREMENT;

COPPER;

EID: 0033489324     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. A.K. Biswas, W.G. Davenport, Extractive Metallurgy of Copper, Pergamon, Elsevier Science Inc., New York, USA, ISBN 0 08 042124 5
2. Ullmanns Encyclopedia of Industrial Chemistry, VCH Verlagsgesellschaft mbH, Weinheim, Germany, Vol. A25,54 - 55
3. K. Knuutila, O. Forsen and A. Pehkonen, "The Effect of Organic Additives on the Electrocrystallization of Copper", TMS, Warrendale, Pennsylvania, USA, 1987, 145 - 152.
4. Bernd E. Langner and Peter Stantke, "The Use of the CollaMat - System for Measuring Glue Activity in Copper Electrolyte in the Laboratory and in the Production Plant" EPD Congress 1995, TMS, Warrendale, Pennsylvania, USA, 1995, 559 - 569.