Additive monitoring and interactions during copper electroprocessing

4th International Conference COPPER 99-COBRE 99

Volumn , Issue , 1999, Pages 461-477

  Collins, D W ^a   Hiskey, J B ^a  

^a University of Arizona   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; CRYSTAL STRUCTURE; CYCLIC VOLTAMMETRY; DECOMPOSITION; ELECTROLYTES; ELECTROPLATING; MORPHOLOGY; POLARIZATION;

CHRONOPOTENTIOMETRY; ELECTROREFINING; ELECTROWINNING; TAFEL ANALYSIS; THIOUREA;

COPPER;

EID: 0033489163     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (37)

1. J.O.M. Bockris and A.K.N. Reddy, Modern Electrochemistry 2, Plenum Press, New York, NY, USA, 1970, 1173-1230.
2. U. Bertocci and D.R. Turner, "Copper," Encyclopedia of Electrochemistry of the Elements, Vol. 2, A.J. Bard, Ed., 1974, 383-497.
3. J.O.M. Bockris and M. Enyo, "Copper in Aqueous Solutions," Transactions of the Faraday Society, Vol. 58, 1961, 1187-1202.
4. E. Mattsson and J.O.M. Bockris, "Galvanostatic Studies of the Kinetics of Deposition and Dissolution in the Copper + Copper Sulphate System," Transactions of the Faraday Society, Vol. 55, 1959, 1586-1601.
5. J.D. Reid and A.P. David, "Impedance Behaviour of Sulfuric Acid-cupric Sulfate/Copper Cathode Interface," Journal of Electrochemical Society, Vol. 134, No. 6, 1987, 1389-1394.
6. K.I. Popov, L.M. Djukic, M.G. Pavlovic, et al., "The Critical Overpotential for Copper Dendrite Formation," Journal of Applied Electrochemistry, Vol. 9, 1979, 527-531.
7. N. Ibl, P. Javetand and F. Stahel, "Note on the Electrodeposits Obtained at the Limiting Current," Electrochimica Acta, Vol. 17, 1972, 733-739.
8. J.M. Schloen, "Electrolytic Copper Refining - Tank Room Data," W.C. Cooper, D.J. Kemp, G.E. Legos and K.G. Tan, Eds., Pergamon Press, New York, NY, USA, 1991, 491-507.
9. T. Robinson and W.G. Davenport, "Electrolytic Copper Electrowining and Solvent Extraction World Operating Data," These Proceedings.
10. R. Winand, "Electrocrystallization," Applications of Polarization Measurements in the Control of Metal Deopsition, Process Metallurgy 3, I. H. Warren, Ed., Elsevier Science Publishers, Amsterdam, 1984, 47-83.
11. R. Winand and P. Harlet, "High-Current Density Copper Electrorefining," Transactions of the Institution of Mining and Metallurgy Section C-Mineral Processing and Extractive Metallurgy, Vol. 101, 1992, C33-C44.
12. P.A.R. EG&G, Thiourea and Substituted Thioureas, in Application Brief T-1,.
13. B. Langer P. Stantke, E.-F. Reinking, et al., "Method of Measuring the Effective Inhibitor Concentration During a Deposition of Metal From Aqueous Electrolytes and Test Apparatus Therefor," United States Patent, 4,834,842, 30 May 1989.
14. B.D. Rogers, C.C. Smith, R.L. Brisebois, et al., "Cyclic Voltammetry", United States Patent, 5,124,011, 23 June 1992.
15. N.R. Bharucha, Z. Zavorsky and R.L. Leroy, "Electrochemical Determination of Glue in Copper Refinery Electrolyte," Metallurgical Transactions B, Vol. 9B, 1978, 509-514.
16. B.R. Conrad, B. Rogers, R. Brisebois and C. Smith, "INCO Copper Refinery Addition Agent Monitoring Using Cyclic Voltammetry," Proceedings of the International Symposium on Electrometallurgical Plant Practice, P.L. Claessens and G.B. Harris, Pergamon, New York, NY, USA, 1990, 291-313.
17. R. Haak, C. Ogdenand and D. Tench, "Cyclic Voltammetric Stripping Analysis of Acid Copper Sulfate Plating Baths: Part I: Polyether-sulfide-based Additives," Plating and Surface Finishing, April, 1981, 52-55.
18. C. Ogden and D. Tench, "Cyclic Voltammetric Stripping Analysis of Copper Plating Baths," Applications of Polarization Measurements in the Control of Metal Deposition, Process Metallurgy 3, I. H. Warren, Ed., Elsevier Science Publishers, Amsterdam, 1984, 229-240.
19. M.L. Rothstein, W.M. Peterson and H. Siegerman, "Polarographic Methods of Analyzing Plating Baths," Plating and Surface Finishing, June, 1981, 78-83.
20. H. Wikiel, C. Manger, D. Hazebrouck, et al., "On-line Monitoring of Chemical Processes in Electronic Components Manufacturing," Paper presented at the CHIPCON '97 Conference, Sunnyvale, CA, USA, 20-21 February 1997.
21. F.A. Ludwig, "Method of Monitoring Trace Constituents in Plating Baths", United States Patent, 4,631,116, 23 December 1986.
22. Z. Lukaszewski, "Tensammetric Techniques for Electroanalysis," Electroanalysis, Vol. 5, No. 5, 1993, 375-384.
23. D.E. Smith and W.H. Reinmuth, "Second Harmonic Alternating Current Polarography With a Reversible Electrode Process," Analytical Chemistry, Vol. 33, No. 4, 1961, 482-485.
24. D.E. Smith, "AC Polargraphy and Related Techniques: Theory and Practice," Electroanalytical Chemistry, A series of advances, A. J. Bard, Ed., Vol. 1, Marcel Dekker, Inc., New York, USA, 1996, 1-155.
25. A.J. Bard and L.R. Faulkner, Electrochemical Methods Fundamentals and Applications, John Wiley and Sons, New York, NY, USA, 1980.
26. V.K. Blechta, Z.Z. Wangand and D.W. Krueger, "Glue Analysis and Behavior in Copper Electrolyte," Metallurgical Transactions B, Vol. 24B, 1993, 277-287.
27. B.M. Eliash, N.H. Phan, F.A. Ludwig, et al., "Electrode Proconditioning Method For a Plating Bath Monitoring Process", United States Patent, 5,324,400, 28 June 1994.
28. F.A. Ludwig, B.M. Eliash, N.H. Phan, et al., "Method of Monitoring Constituents in Plating Baths," United States Patent, 5,320,724, 14 June 1994.
29. N.H. Phan, V.N.R.K. Reddy, F.A. Ludwig, et al., "Method Of Monitoring Major Constituents In Plating Baths," United States Patent, 5,336,380, 9 August 1994.
30. J.M. Schloen and W.G. Davenport, "Electrolytic Copper Refining - World Tankhouse Operating Data," Copper 95, Vol. III, W.C. Cooper, D.B. Dreisinger, J.E. Dutrizac, H. Hein and G. Ugarte, Eds., The Metallurgical Society of the CIM, Montreal, Canada, 1995, 3-25.
31. Y.M. Loshkarev and E.M. Govorova, "The Electrodeposition of Copper in the Presence of Brightening And Smoothing Agents," Protection of Metals, Vol. 34, No. 5, 1998, 399-415.
32. T.J. O'Keefe, "Influence of Trace Impurities and Additives in Electrolytic Processing," Applications of Polarization Measurements in the Control of Metal Deposition, Process Metallurgy 3, I. H. Warren, Ed.: Elsevier Science Publishers, Amsterdam, 1984, 15-31.
33. C.-T. Wang and T.J. O'Keefe, "The Influence of Additives and Their Interactions on Copper Electrorefining," International Symposium on Electrochemistry in Mineral and Metal Processing, P. Richardson, S. Srinavasea and R. Woods, Eds., The Electrochemical Society, Pennington, NJ, USA, 1984.
34. G. Fabricius and G. Sundholm, "The Effect of Additives On the Electrodeposition of Copper Studied by the Impedance Technique," Journal of Applied Electrochemistry, Vol. 14, No. 6, 1984, 797-801.
35. M. Sun and T.J. O'Keefe, "The Effect of Additives on the Nucleation and Growth of Copper onto Stainless Steel Cathodes," Metallurgical Transactions B, Vol. 23B, 1992, 591-599.
36. M.D. Saban, J.D. Scott and R.M. Cassidy, "Collagen Proteins in Electrorefining: Rate Constants for Glue Hydrolysis and Effects of Molar Mass on Glue Activity," Metallurgical Transactions B, Vol. 23b, 1992, 125-133.
37. P.M. Bersier, W. Neagle and D. Clark, "Monitoring and Assay Of Water Treatment Additives By Alternating Current Tensammetry and Voltammetry: Scope And Limitations," Analyst, Vol. 117, No. 5, 1992, 863-868.