Rectangular magnetron with full target erosion

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 17, Issue 2, 1999, Pages 555-563

  Musil, J ^a  

^a UNIVERSITY OF WEST BOHEMIA   (Czech Republic)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0033445242     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.581618     Document Type: Article

References (9)

1. J. A. Thornton, Met. Finish. 77, 45 (1997).
2. W. H. Class, US Patent No. 4 198 283, MRC INSET™ target.
3. R. Kukla, J. Kieser, and M. Mayer, IEEE Trans. Magn. 23, 137 (1987).
4. H. Aichert, J. Kieser, and R. Kukla, US Patent No. 4 572 776, 25.2.1986.
5. T. Takahashi and M. Naoe, IEEE Trans. Magn. 25, 4174 (1989).
6. Bulletin Kurt J. Lesker Company, Magnetron sputter deposition sources, Torus®, 412-233-4200, 1995.
7. Bulletin of Sloan Technology Corporation, Dynamic Planar Magnetron Sputtering Source, Orbitor™,T-133A-2M-782, US Patent No. 3 878 085.
8. C. B. Garrett, US Patent No. 4 444 643, April 24, 1984.
9. J. Musil, Invited Paper at 7th Joint Vacuum Conference, May 26-29, 1997, Debrecen, Hungary; Vacuum 50, 363 (1998).