Influence of wafer's back-surface finish on dry-etching characteristics

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 17, Issue 5, 1999, Pages 3125-3128

  Muramatsu, S ^a   Ando, K ^a   Nanbu, H ^a   Miyamoto, H ^a   Kitano, T ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0033440706     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.582015     Document Type: Article

References (3)

1. G. A. Wardly, Rev. Sci. Instram. 44, 1506 (1973).
2. J. Field, Semicond. Sci. Technol. 9, 91 (1994).
3. L. D. Hartsough, Semicond. Sci. Technol. 1, 187 (1986).