Aluminum silicon carbide (AlSiC) thermal management packaging for high density packaging applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3830, Issue , 1999, Pages 34-39

  Occhionero, Mark A ^a   Hay, Robert A ^a   Adams, Richard W ^a   Fennessy, Kevin P ^a  

^a Ceramics Process Systems Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; ELECTRONICS PACKAGING; METALLIC MATRIX COMPOSITES; MICROELECTRONIC PROCESSING; PERFORMANCE; RELIABILITY; THERMAL CONDUCTIVITY; THERMAL CYCLING; THERMAL EXPANSION;

ALUMINUM SILICON CARBIDE; CERAMICS PROCESS SYSTEMS; COEFFICIENT OF THERMAL EXPANSION; HIGH DENSITY INTERCONNECT; THERMAL MANAGEMENT PACKAGING;

SEMICONDUCTING ALUMINUM COMPOUNDS;

EID: 0033366574     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)