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Volumn 12, Issue 2, 1999, Pages 175-183

Extraction of wafer-level defect density distributions to improve yield prediction

Author keywords

[No Author keywords available]

Indexed keywords

INSPECTION; PROCESS CONTROL; SEMICONDUCTOR DEVICE STRUCTURES; SILICON WAFERS; YIELD STRESS;

EID: 0033366371     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/66.762875     Document Type: Article
Times cited : (25)

References (13)
  • 1
    • 0025433611 scopus 로고
    • The use and evaluation of yield models in integrated circuits
    • May
    • J. A. Cunningham, "The use and evaluation of yield models in integrated circuits," IEEE Trans. Semiconduct. Manufact., vol. 3, pp. 60-71, May 1990.
    • (1990) IEEE Trans. Semiconduct. Manufact. , vol.3 , pp. 60-71
    • Cunningham, J.A.1
  • 3
    • 0021782318 scopus 로고
    • The effects of wafer to wafer defect density variations on integrated circuit defect and fault distributions
    • Jan.
    • C. H. Stapper, "The effects of wafer to wafer defect density variations on integrated circuit defect and fault distributions," IBM J. Res. Develop., vol. 29, no. 1, pp. 85-97, Jan. 1985.
    • (1985) IBM J. Res. Develop. , vol.29 , Issue.1 , pp. 85-97
    • Stapper, C.H.1
  • 5
    • 0022719974 scopus 로고
    • On yield fault distributions and clustering of particles
    • May
    • C. H. Stapper, "On yield fault distributions and clustering of particles," IBM J. Res. Develop., vol. 30, no. 3, pp. 326-338, May 1986.
    • (1986) IBM J. Res. Develop. , vol.30 , Issue.3 , pp. 326-338
    • Stapper, C.H.1
  • 6
    • 0037840074 scopus 로고
    • Microelectronic test chips for VLSI electronics
    • New York: Academic, ch. 9
    • M. G. Buehler, "Microelectronic test chips for VLSI electronics," in VLS Electronics Microstructure Science, vol. 9. New York: Academic, 1983, ch. 9, pp. 529-576.
    • (1983) VLS Electronics Microstructure Science , vol.9 , pp. 529-576
    • Buehler, M.G.1
  • 7
    • 0022680566 scopus 로고
    • CMOS test chip design for process problem debugging and yield prediction experiments
    • Mar.
    • W. Lukaszek, W. Yarbrough, T. Walker, and J. Meindl, "CMOS test chip design for process problem debugging and yield prediction experiments," Solid State Technol., pp. 87-92, Mar. 1986.
    • (1986) Solid State Technol. , pp. 87-92
    • Lukaszek, W.1    Yarbrough, W.2    Walker, T.3    Meindl, J.4
  • 8
    • 0003382830 scopus 로고    scopus 로고
    • Customized checkerboard test structures to localize interconnection point defects
    • Santa Clara, CA
    • C. Hess, L. H. Weiland, and R. Bornefeld, "Customized checkerboard test structures to localize interconnection point defects," in Proc. VLSI Multilevel Interconnection Conf. (VMIC), Santa Clara, CA, 1997, pp. 163-168.
    • (1997) Proc. VLSI Multilevel Interconnection Conf. (VMIC) , pp. 163-168
    • Hess, C.1    Weiland, L.H.2    Bornefeld, R.3
  • 11
    • 0031639082 scopus 로고    scopus 로고
    • Wafer level defect density distribution using checkerboard test structures
    • Kanazawa, Japan
    • C. Hess and L. H. Weiland, "Wafer level defect density distribution using checkerboard test structures," in Proc. Int. Conf. Microelectronic Test Structures (ICMTS), Kanazawa, Japan, 1998, pp. 101-106.
    • (1998) Proc. Int. Conf. Microelectronic Test Structures (ICMTS) , pp. 101-106
    • Hess, C.1    Weiland, L.H.2
  • 12
    • 0015423592 scopus 로고
    • Analysis of yield of integrated circuits and a new expression of the yield
    • Dec.
    • T. Okabe, M. Nagata, and S. Shimada, "Analysis of yield of integrated circuits and a new expression of the yield," Elect. Eng. Japan, vol. 92, pp. 135-141, Dec. 1972.
    • (1972) Elect. Eng. Japan , vol.92 , pp. 135-141
    • Okabe, T.1    Nagata, M.2    Shimada, S.3
  • 13
    • 0010968585 scopus 로고
    • Defect density distribution for LSI yield calculations
    • July
    • C. H. Stapper, "Defect density distribution for LSI yield calculations," IEEE Trans. Electron Devices, vol. ED-20, pp. 655-659, July 1973.
    • (1973) IEEE Trans. Electron Devices , vol.ED-20 , pp. 655-659
    • Stapper, C.H.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.