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Volumn 3830, Issue , 1999, Pages 237-241
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Microwave MCM-C utilizing low loss LTCC and photo-patterning processes
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Author keywords
[No Author keywords available]
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Indexed keywords
CERAMIC MATERIALS;
DENSITY (SPECIFIC GRAVITY);
FREQUENCIES;
MICROPROCESSOR CHIPS;
MICROWAVES;
PERMITTIVITY;
RADIO;
THICK FILMS;
CO-FIRED CERAMIC;
INTERCONNECT DENSITY;
LOW LOSS LTCC TECHNOLOGY;
PHOTO PATTERNING PROCESSES;
ELECTRONICS PACKAGING;
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EID: 0033364240
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (3)
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References (2)
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