Future package reliability testing

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3830, Issue , 1999, Pages 389-394

  Evans, Thomas C ^a  

^a LSI Logic Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AVAILABILITY; CONSUMER ELECTRONICS; ERROR ANALYSIS; ESTIMATION; RELIABILITY; SEMICONDUCTOR DEVICES; STRESSES;

CHIPSCALE PACKAGING; PHYSICS OF FAILURE; RELIABILITY TESTING; SEMICONDUCTOR PACKAGES;

ELECTRONICS PACKAGING;

EID: 0033363604     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)