V-band planar Gunn oscillators and VCOs on AlN substrates using flip-chip bonding technology

IEEE MTT-S International Microwave Symposium Digest

Volumn 1, Issue , 1999, Pages 13-16

  Watanabe, K ^a   Deguchi, T ^a   Nakagawa, A ^a  

^a JAPAN RADIO CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; FLIP CHIP DEVICES; GUNN DIODES; INTEGRATED CIRCUIT MANUFACTURE; SEMICONDUCTING ALUMINUM COMPOUNDS; SEMICONDUCTING FILMS; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTOR DEVICE STRUCTURES; VARIABLE FREQUENCY OSCILLATORS;

ALUMINUM NITRIDE; FLIP CHIP BONDING TECHNOLOGY; PHASE NOISE;

GUNN OSCILLATORS;

EID: 0033363187     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)