Three-dimensional, W-band circuits using Si micromachining

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 1999, Pages 441-444

  Henderson, Rashaunda M ^a   Weller, Thomas M ^a   Katehi, Linda P B ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; MICROMACHINING; MICROWAVE INTEGRATED CIRCUITS; MULTILAYERS; PERFORMANCE; SILICON WAFERS; THREE DIMENSIONAL;

HIGH DENSITY INTEGRATION; POWER DISTRIBUTION NETWORK; W-BAND OPERATION;

ELECTRONICS PACKAGING;

EID: 0033362306     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)