Formation of the density profile and its effects on the properties of particleboard

Wood Science and Technology

Volumn 33, Issue 4, 1999, Pages 327-340

  Wong, E D ^a   Zhang, M ^a   Wang, Q ^a,b   Kawai, S ^a  

^a KYOTO UNIVERSITY   (Japan)

^b Hokushin Co Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); CORRELATION METHODS; DENSITY (SPECIFIC GRAVITY); ELASTICITY; MOISTURE; REGRESSION ANALYSIS; RESINS;

SCREW WITHDRAWAL RESISTANCE;

PARTICLE BOARD;

EID: 0033360120     PISSN: 00437719     EISSN: None     Source Type: Journal    
DOI: 10.1007/s002260050119     Document Type: Article

References (7)

1. Kawai S, Sasaki H (1986) Production technology for low-density particleboard I-Forming a density gradient and its effect on board properties. Mokuzai Gakkaishi, J. Jpn. Wood Res. Soc. 32(5): 324-330
2. Kawai S, Sasaki H (1993) Low-density particleboard. In: Shiraishi N, Kajita H, Norimoto M (Eds.) Current Japanese Materials Research. Vol. 11, pp. 33-41. Japan: Elsevier Applied Science
3. Kelly MW (1977) Critical literature review of relationships between processing parameters and physical properties of particleboard, pp. 4-15. Madison: USDA Forest Service
4. Moslemi AA (1974) Particleboard - Vol. 2: Technology, pp. 89-130. Illinois: Southern Illinois University Press
5. Shen KC, Carroll MN (1970) Measurement of layer-strength distribution in particleboard. Forest Products Journal 20(6): 53-55
6. Strickler MD (1959) Effect of press cycles and moisture content on properties of douglas-fir flakeboard. Forest Products Journal 7: 203-215
7. Suchsland O, Woodson GE (1986) Fiberboard manufacturing practices in the United States, pp. 112-158. Madison: USDA Forest Service