Heat transfer in electrical insulation of LHC cables cooled with superfluid helium

Cryogenics

Volumn 39, Issue 11, 1999, Pages 921-931

  Meuris, C ^a   Baudouy, B ^a   Leroy, D ^b   Szeless, B ^b  

^a CEA SACLAY   (France)

^b CERN   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

COLLIDING BEAM ACCELERATORS; COOLING; ELECTRIC INSULATING MATERIALS; HEAT LOSSES; HEAT TRANSFER; MATHEMATICAL MODELS; MOCKUPS; SUPERCONDUCTING MAGNETS; SUPERFLUID HELIUM; TEMPERATURE DISTRIBUTION; TEMPERATURE MEASUREMENT; THERMAL INSULATING MATERIALS;

LARGE HADRON COLLIDERS (LHC);

SUPERCONDUCTING CABLES;

EID: 0033355265     PISSN: 00112275     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0011-2275(99)00115-0     Document Type: Article

References (11)

1. The LHC Study Group. The Large Hadron Collider concept design. Report CERN/AC/95-05-LHC, 1995.
2. Burnod L, Jeanneret JB. Beam losses and collimation in the LHC. Report CERN/SL/91-39, 1991.
3. Burnod L, Leroy D, Szeless B, Baudouy B, Meuris C. Thermal modelling of the LHC dipoles functioning in superfluid helium. In: Proceedings of 1994 EPAC Conference. London, 1994.
4. Baudouy B. Etude des transferts de chaleur dans les isolations électriques de câbles supraconducteurs d'aimant d'accélérateur refroidi par helium superfluide. Thèse de Doctorat de l'Université Paris VI, 1996.
5. Szeless B. Electrical insulation of superconducting cables and coils in LHC magnets. Cryogenics. 38:1998;13.
6. Meuris C. Heat transport in insulation of cables cooled by superfluid helium. Cryogenics. 31:1991;625.
7. Gorter C.J., Mellink J.H. Physica. 15:1949;285.
8. Arp V et al. HEPAK. Cryodata, 1992.
9. CASTEM 2000. Finite element program, CEA/DEMT.
10. Vieillard L, Etude des transferts thermiques dans des matériaux isolants et perméables à l'helium superfluide. Rapport CEA/FIUPSO, 1994.
11. Baudouy B, Boucheffa A, François MX, Meuris C, Thermal behaviour of electrical multilayer insulation permeable to superfluid helium. In: Proceedings of the 16th International Cryogenic Engineering Conference, Part 1. Kitakyushu: Elsevier, 1996, p. 563.