High frequency losses in transmission lines made on SIMOX, bulk silicon and depleted silicon/silicon structures formed by wafer bonding

IEEE International SOI Conference

Volumn , Issue , 1999, Pages 30-31

  Johansson, Mikael ^a   Bergh, Mats ^a   Bengtsson, Stefan ^a  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; BONDING; CAPACITANCE MEASUREMENT; ELECTRIC CURRENTS; ELECTRIC LINES; INTERFACES (MATERIALS); OXYGEN; SEPARATION; SILICA; SILICON WAFERS; VOLTAGE MEASUREMENT;

SEPARATION BY IMPLANTATION OF OXYGEN (SIMOX);

SEMICONDUCTOR DEVICE STRUCTURES;

EID: 0033351815     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)