Silicon substrates with microwhisker structure - an innovative heat spreader technology for power electronics application

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3906, Issue , 1999, Pages 474-479

  Hammel, E ^a   Holzer, H ^a   Hanreich, G ^a   Nicolics, J ^a  

^a Electrovac GmbH   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL STRUCTURE; CRYSTAL WHISKERS; CURRENT DENSITY; ELECTRIC LOSSES; ELECTRONICS PACKAGING; HEAT CONDUCTION; HEAT TRANSFER COEFFICIENTS; LASER APPLICATIONS; MATHEMATICAL MODELS; SEMICONDUCTING SILICON; SUBSTRATES; TEMPERATURE;

HEAT SPREADER TECHNOLOGY; MICROWHISKER; REVERSE THERMAL MODELLING; THERMOVISION;

POWER ELECTRONICS;

EID: 0033351741     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)