Characterization of glass on electronics in MEMS

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3875, Issue , 1999, Pages 73-78

  Patel, Shefali ^a   Delaney, Drew ^a   Xu, DaXu,e ^a   Murphy, Gene ^a   Denton, Heidi ^a   Hughes, Henry ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; COMPOSITION EFFECTS; COSTS; ELECTRIC PROPERTIES; ELECTRONICS PACKAGING; ENCAPSULATION; GLASS; HIGH TEMPERATURE OPERATIONS; MICROMACHINING; MICROSENSORS; RELIABILITY; SEMICONDUCTING SILICON;

CONTROL CIRCUITRY; ELECTRICAL TEST; FRIT GLASS; MICROELECTROMECHANICAL SYSTEMS;

MICROELECTROMECHANICAL DEVICES;

EID: 0033348326     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)