Transient two-dimensional thermal analysis of electronic packages by the boundary element method

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 3, 1999, Pages 476-486

  Guven, Ibrahim ^a  

^a UNIVERSITY OF ARIZONA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY ELEMENT METHOD; ELECTRONICS PACKAGING; THERMOANALYSIS; TRANSIENTS;

TRANSIENT CONDUCTION-CONVECTION;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0033348206     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.784502     Document Type: Article

References (8)

1. K. P. Banerjee and R. Butterfield, Boundary Element Methods in Engineering Science. London, U.K.: McGraw-Hill, 1981.
2. S. Mukherjee, Boundary Element Methods in Creep and Fracture. Barking, Essex, U.K.: Elsevier, 1982.
3. C. A. Brebbia, J. C. F. Telles, and L. C. Worbel, Boundary Element Techniques; Theory and Applications in Engineering. Berlin, Germany: Springer-Verlag, 1984.
4. C. L. Chan, "A local iteration scheme for nonlinear two-dimensional steady-state heat conduction: A bem approach," Appl. Math. Model., vol. 17, pp. 650-657, 1993
5. H. Kabir, A. Ortega, and C. L. Chan, "A boundary element formulation of the conjugate heat transfer from a convectively cooled discrete heat source mounted on a conductive substrate," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 18, pp. 108-116, Mar. 1995.
6. K. Kokini, "Material compatibility in interfacial transient thermal fracture of ceramic-to-metal bonds," J. Appl. Mech., vol. 55, pp. 767-772, 1988.
7. C. L. Chan and A. Chandra, "An algorithm for handling corners in the boundary element method: Application to conduction-convection equations," Appl. Math. Model., vol. 15, pp. 244-255, 1991.
8. D. Münz, T. Fett, and Y. Y. Yang, "The regular stress term in bonded dissimilar materials after a change in temperature," Eng. Fract. Mech., vol. 44, pp. 185-194, 1993.