'System on a chip' technology platform for 0.18μm digital, mixed signal & eDRAM applications

Technical Digest - International Electron Devices Meeting

Volumn , Issue , 1999, Pages 849-852

  Mahnkopf, R ^a   Allers, K H ^a   Armacost, M ^a   Augustin, A ^a   Barth, J ^a   Brase, G ^a   Busch, R ^a   Demm, E ^a   Dietz, G ^a   Flietner, B ^a   Friese, G ^a   Grellner, F ^a   Han, K ^a   Hannon, R ^a   Ho, H ^a   et al , ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DIGITAL PROCESS; METAL INSULATOR METAL CAPACITOR; SYSTEM ON A CHIP INTEGRATION;

APPLICATION SPECIFIC INTEGRATED CIRCUITS; CAPACITORS; COPPER; COST EFFECTIVENESS; ELECTRON DEVICE MANUFACTURE; GATES (TRANSISTOR); ION IMPLANTATION; METALLIZING; MICROPROCESSOR CHIPS; SEMICONDUCTING BORON; THRESHOLD VOLTAGE; TRANSISTORS;

DYNAMIC RANDOM ACCESS STORAGE;

EID: 0033345387     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)