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Volumn E82-C, Issue 6, 1999, Pages 955-966
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Non-uniform multi-layer IC interconnect transmission line characterization for fast signal transient simulation of high-speed/high-density VLSI circuits
a
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Author keywords
[No Author keywords available]
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Indexed keywords
CAPACITANCE;
COMPUTER AIDED DESIGN;
COMPUTER SIMULATION;
CROSSTALK;
ELECTRIC SHIELDING;
INTERCONNECTION NETWORKS;
SEMICONDUCTING SILICON;
SUBSTRATES;
VLSI CIRCUITS;
INTERCONNECTS;
SHIELDING EFFECT;
SIGNAL DELAY;
SIGNAL INTEGRITY;
SUBSTRATE EFFECT;
ELECTRIC LINES;
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EID: 0033345072
PISSN: 09168524
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (4)
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References (22)
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