Stress analysis for through hole area in multilayer alumina ceramic substrate

Journal of the Ceramic Society of Japan

Volumn 107, Issue 12, 1999, Pages 1188-1192

  Ishihara, Shosaku ^a   Fujita, Tsuyoshi ^a   Yasukawa, Akio ^a  

^a HITACHI LTD   (Japan)

Author keywords

Ceramic substrate; Elastic deformation; FEM method; Stress analysis; Through hole

Indexed keywords

ALUMINA; DEFORMATION; ELASTIC MODULI; FINITE ELEMENT METHOD; FIRING (OF MATERIALS); INTERFACES (MATERIALS); MULTILAYERS; STRESS ANALYSIS; SUBSTRATES; THERMAL EXPANSION;

THROUGH HOLE AREA;

CERAMIC MATERIALS;

EID: 0033344555     PISSN: 09145400     EISSN: None     Source Type: Journal    
DOI: 10.2109/jcersj.107.1188     Document Type: Article

References (9)

1. S. Kapur, Proc. Electonic Components Technology Conference, IEEE (1992) pp. 129-33.
2. G. A. Walker, Proc. Reliability Physics, IEEE, 227-31 (1980).
3. Y. Kitamura, "Denki Gakkai Zenkoku Taikai" (1989) pp. 3-89 [in Japanese].
4. C. H. Hsueh and A. G. Evans, J. Am. Ceram. Soc., 68, 120-27 (1985).
5. T. Ueyama, J. Japan Soc. Powder Powder Metall., 38, 597-604 (1991) [in Japanese].
6. G. Toda, S. Ishihara and T. Fujita, J. Ceram. Soc. Japan (Seramikkusu Ronbunshi), 99, 1166-68 (1991) [in Japanese].
7. The Japan Institute of Metals ed., "Kikai Kougaku Binran," A4 (1987) pp. 71-73 [in Japanese].
8. The Japan Institute of Metals ed., "Kinzoku Data Book" (1984) p. 35 [in Japanese].
9. The Ceramic Society of Japan ed., "Ceramic Kougaku Handbook" (1989) p. 385 [in Japanese].