Application of vapor phase decomposition/total reflection X-ray fluorescence in the silicon semiconductor manufacturing environment

Spectrochimica acta, Part B: Atomic spectroscopy

Volumn 54, Issue 10, 1999, Pages 1399-1407

  Buhrer, Gayle ^a  

^a MICRON TECHNOLOGY INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL IMPURITIES; DECOMPOSITION; EMISSION SPECTROSCOPY; FLUORESCENCE; LIGHT REFLECTION; MASS SPECTROMETRY; PLASMA APPLICATIONS; SEMICONDUCTOR DEVICE MANUFACTURE; SPECTROMETRY; TRACE ANALYSIS; TRACE ELEMENTS; X RAY SPECTROSCOPY;

DEPTH PROFILING; INDUCTIVELY-COUPLED PLASMAS (ICP); TOTAL-REFLECTION X RAY FLUORESCENCE (TXRF) SPECTROMETRY; VAPOR PHASE DECOMPOSITION (VPD);

SILICON WAFERS;

EID: 0033343674     PISSN: 05848547     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0584-8547(99)00084-1     Document Type: Article

References (14)

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