Distributed effects of a gap in power/ground planes

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1999, Pages 207-210

  Duan, Dah Weih ^a   Rubin, Barry J ^a   Magerlein, J H ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INDUCTANCE MEASUREMENT; PRINTED CIRCUIT MANUFACTURE;

FULL-WAVE ELECTROMAGNETIC TOOLS; POWER/GROUND PLANES;

ELECTRONICS PACKAGING;

EID: 0033340885     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (3)