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1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Conference Proceedings

Volumn , Issue , 1999, Pages 169-172

Evaluation of 300 mm wafer boxes with UV/photoelectron cleaning capability

(6) Yokoyama, S a Hara, Y a Yoshino, T b Suzuki, T c Fujii, T a Ohyama, K a

a HIROSHIMA UNIVERSITY (Japan)

b EBARA CORPORATION (Japan)

c Dainichi Shoji K K (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CLEANING; MANUFACTURE; MOS DEVICES; PLASTIC CONTAINERS; POLYCARBONATES; SEMICONDUCTOR DEVICE MANUFACTURE; CRYSTAL IMPURITIES; GATES (TRANSISTOR); INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUIT TESTING; RELIABILITY; SEMICONDUCTOR DEVICE TESTING; SILICON WAFERS; ULTRAVIOLET RADIATION;

300 MM WAFERS; LSI FABRICATION; ORGANIC MOLECULES; PLASTIC MATERIALS; PLASTIC WAFERS; RELIABILITY TEST; SI WAFER; THIN GATE OXIDES;

SILICON WAFERS; LSI CIRCUITS;

ULTRAVIOLET/PHOTOELECTRON CLEANING;

EID: 0033339454 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ISSM.1999.808764 Document Type: Conference Paper

Times cited : (7)

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