A proposal for energy saving in semiconductor fabs

1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Conference Proceedings

Volumn , Issue , 1999, Pages 255-258

  Suenaga, O ^a   Kobayashi, S ^b   Ohmi, T ^c  

^a TOKYO ELECTRON LTD   (Japan)

^b TAISEI CORPORATION   (Japan)

^c TOHOKU UNIVERSITY   (Japan)

Author keywords

cooling wates exhaust; double layer coolcs hear insulator; energy saving consumption

Indexed keywords

CLEAN ROOMS; COOLING; COOLING WATER; ENERGY UTILIZATION; FURNACES; MANUFACTURE; SEMICONDUCTOR DEVICE MANUFACTURE; AIR POLLUTION CONTROL; ENERGY CONSERVATION; EXHAUST GASES; HEAT TRANSFER; THERMAL INSULATING MATERIALS;

DIFFUSION FURNACE; DOUBLE LAYERS; EXHAUST AIR; HEAT INSULATION MATERIALS; SEMICONDUCTOR FABS;

ENERGY CONSERVATION; SEMICONDUCTOR DEVICE MANUFACTURE;

DIFFUSION FURNACES; DOUBLE LAYER COOLERS;

EID: 0033336893     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSM.1999.808784     Document Type: Conference Paper

References (3)

1. N. Tsukamoto, "Recent Technologies for Energy Saving of Clean Room Operation," Clean Technolozy, No.6, 1992, pp.27-29
2. T. Ohmi, "Advanced Equipment-Cooling System," Break Through, No.7 I , 1992, p.23
3. M. Iguchi, "Managemcnt of Heat Energy," Enno.gy Saving Cenfer, 1996, p.40