|
Volumn 3883, Issue , 1999, Pages 24-33
|
Copper contamination effect on the reliability of devices in the BiCMOS technology
a a a a a |
Author keywords
[No Author keywords available]
|
Indexed keywords
ABSORPTION SPECTROSCOPY;
ANNEALING;
CMOS INTEGRATED CIRCUITS;
CONTAMINATION;
DECOMPOSITION;
DIFFUSION;
ELECTRIC VARIABLES MEASUREMENT;
HIGH TEMPERATURE OPERATIONS;
OXYGEN;
PRECIPITATION (CHEMICAL);
SURFACES;
ATOMIC ABSORPTION SPECTROSCOPY;
GUMMEL PLOT MEASUREMENT;
INTERNAL GETTERING;
SIMULATED DRIVE IN DIFFUSION;
VAPOR PHASE DECOMPOSITION;
WAFER;
COPPER;
|
EID: 0033336606
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1117/12.360578 Document Type: Conference Paper |
Times cited : (3)
|
References (26)
|