Fracture behavior of high thermal conductive aluminum nitride

Ceramic Engineering and Science Proceedings

Volumn 20, Issue 3, 1999, Pages 411-418

  Tatami, J ^a   Komeya, K ^a   Meguro, T ^a   Iwasawa, S ^a   Komatsu, M ^a  

^a YOKOHAMA NATIONAL UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; FRACTURE TESTING; FRACTURE TOUGHNESS; GRAIN BOUNDARIES; POLYCRYSTALLINE MATERIALS; SINTERING; THERMAL CONDUCTIVITY OF SOLIDS;

ALUMINUM NITRIDE; TRANSGRANULAR FRACTURE;

CERAMIC MATERIALS;

EID: 0033336394     PISSN: 01966219     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (6)